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Simulation of three-dimensional laminar flow and heat transfer in an array of parallel microchannels

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dc.contributor.advisor Anand, N. K. en_US
dc.creator Mlcak, Justin Dale en_US
dc.date.accessioned 2010-01-14T23:55:37Z en_US
dc.date.accessioned 2010-01-16T02:02:15Z
dc.date.available 2010-01-14T23:55:37Z en_US
dc.date.available 2010-01-16T02:02:15Z
dc.date.created 2007-05 en_US
dc.date.issued 2009-05-15 en_US
dc.identifier.uri http://hdl.handle.net/1969.1/ETD-TAMU-1671
dc.description.abstract Heat transfer and fluid flow are studied numerically for a repeating microchannel array with water as the circulating fluid. Generalized transport equations are discretized and solved in three dimensions for velocities, pressure, and temperature. The SIMPLE algorithm is used to link pressure and velocity fields, and a thermally repeated boundary condition is applied along the repeating direction to model the repeating nature of the geometry. The computational domain includes solid silicon and fluid regions. The fluid region consists of a microchannel with a hydraulic diameter of 85.58μm. Independent parameters that were varied in this study are channel aspect ratio and Reynolds number. The aspect ratios range from 0.10 to 1.0 and Reynolds number ranges from 50 to 400. A constant heat flux of 90 W/cm2 is applied to the northern face of the computational domain, which simulates thermal energy generation from an integrated circuit. A simplified model is validated against analytical fully developed flow results and a grid independence study is performed for the complete model. The numerical results for apparent friction coefficient and convective thermal resistance at the channel inlet and exit for the 0.317 aspect ratio are compared with the experimental data. The numerical results closely match the experimental data. This close matching lends credibility to this method for predicting flows and temperatures of water and the silicon substrate in microchannels. Apparent friction coefficients linearly increase with Reynolds number, which is explained by increased entry length for higher Reynolds number flows. The mean temperature of water in the microchannels also linearly increases with channel length after a short thermal entry region. Inlet and outlet thermal resistance values monotonically decrease with increasing Reynolds number and increase with increasing aspect ratio. Thermal and friction coefficient results for large aspect ratios (1 and 0.75) do not differ significantly, but results for small aspect ratios (0.1 and 0.25) notably differ from results of other aspect ratios. en_US
dc.format.medium electronic en_US
dc.format.mimetype application/pdf en_US
dc.language.iso en_US en_US
dc.subject Microchannel en_US
dc.subject SIMPLE en_US
dc.subject Aspect Ratio en_US
dc.subject Channel Flow en_US
dc.subject Forced Convection en_US
dc.title Simulation of three-dimensional laminar flow and heat transfer in an array of parallel microchannels en_US
dc.type Book en
dc.type Thesis en
thesis.degree.department Mechanical Engineering en_US
thesis.degree.discipline Mechanical Engineering en_US
thesis.degree.grantor Texas A&M University en_US
thesis.degree.name Master of Science en_US
thesis.degree.level Masters en_US
dc.contributor.committeeMember Han, Je C. en_US
dc.contributor.committeeMember Hassan, Yassin A. en_US
dc.contributor.committeeMember Rightley, Michael J. en_US
dc.type.genre Electronic Thesis en_US
dc.type.material text en_US
dc.format.digitalOrigin born digital en_US

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